Sapphire LED Grinding WheelSapphire LED Grinding Wheel

Sapphire Ingot과 Wafer 가공에 최적화된 Metal · Vitrified Grinding WheelMetal and vitrified grinding wheels optimized for sapphire ingot and wafer processing.

제품의 용도Applications

Sapphire Ingot — Boule의 C 기준면 가공 Cup Wheel / C면 평탄화 Cup Wheel / 원통 Grinder용 Cup WheelSapphire ingot — cup wheels for C-plane reference, C-plane flattening, and cylindrical grinding
Sapphire Wafer — Wafer Thinning 가공용 Back Grinder WheelSapphire wafer — back grinder wheels for wafer thinning

제품의 특징Features

Wafer 품질, 가공 생산성, Wheel 수명 등 요구 성능에 대한 최적화 설계Optimized for required performance — wafer quality, productivity, and wheel life
Grinding Machine 및 LED Wafer 종류에 따라 특화된 설계 적용Specialized design applied per grinding machine and LED wafer type

Sapphire Metal Grinding Wheel (Non-Dressing Type)Sapphire Metal Grinding Wheel (Non-Dressing Type)

Tornado Type 250~380Ø · #170~#325 Metal WheelTornado Type 250–380Ø · #170–#325 Metal

Metal Grinding Wheel

Ring Type 313Ø · #170~#500 Metal WheelRing Type 313Ø · #170–#500 Metal

Sapphire Vitrified Grinding Wheel / 피삭재Sapphire Vitrified Wheel / Workpiece

297Ø #270 Vitrified Wheel297Ø #270 Vitrified

Ingot flat zone·원통 가공 #60 VitrifiedIngot flat zone & cylindrical #60 Vitrified

Sapphire Ingot & WaferSapphire Ingot & Wafer

Sapphire (LED Material)

LED 공정에 맞는 Grinder Wheel이란?Engineering Wheels for the LED Process

가공 부하 최소화 휠 설계 — Blade와 wafer 표면의 접촉 면적을 최소화해 wafer damage를 축소하고, sludge·chip 배출이 쉽도록 blade 형상·배열 최적화Low-load design — minimized blade-to-wafer contact reduces damage; blade shape/array optimized for sludge and chip evacuation
Wheel 수명뿐 아니라 Sapphire wafer 품질 위주의 휠 설계Design prioritizing sapphire wafer quality, not just wheel life
Wafer 품질 및 Wheel 수명 최적화 설계Balanced optimization of wafer quality and wheel life

가공(Sapphire) 물질 경도Sapphire Material Hardness

광물 종류Material	경도(모오스)Mohs Hardness	가공 여유율Machining Margin
Diamond	10	-
SiC	9.7	3%
Sapphire	9.6	4%
Si	6.2	38%
Fe	4.5	55%
아연 / Zinc	3.5	65%
금 / Gold	2.5	75%
납 / Lead	1.5	85%
흑연 / Graphite	1	90%

SiC·Sapphire는 Diamond 공구와 거의 같은 경도로 가공 여유율이 낮아 전용 Special Wheel 설계가 필요합니다.SiC and sapphire are nearly as hard as diamond tools, leaving little machining margin — a dedicated special wheel design is required.