Home반도체 공구SemiconductorEMC 공구EMC Wheel

EMC 공구EMC Grinding Wheel

반도체 제조 공정에서 Strip Wafer의 두께를 맞추는 Grinding WheelGrinding wheels that control the thickness of strip wafers in semiconductor processing.

제품 개요Overview 실리콘 공구Silicon EMC 공구EMC LED 공구LED 전착 공구Electroplated Micro BladeMicro Blade

제품의 용도Applications

  • 반도체 제조 공정에서 Strip Wafer의 두께를 맞추는 Grinding WheelGrinding wheels that set the thickness of strip wafers in semiconductor processing

제품의 특징Features

  • Damage 영역 최소화 및 Wafer 표면 조도를 고려한 Wheel 설계Minimized damage zone with surface-roughness-aware design
  • 높은 UPEH 실현 설계Design for high UPEH (units per equipment hour)
  • 높은 공구 수명 설계Long tool-life design

EMC Grinding Wheel (Vitrified · Resin)EMC Grinding Wheel (Vitrified · Resin)

EMC Grinding Wheel
EMC Grinding Wheel
EMC Grinding Wheel
EMC Grinding Wheel
EMC Grinding Wheel
EMC Grinding Wheel

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