Home > Semiconductor Tools > LED Tool
Sapphire LED Grinding Wheel

Usage

  • Sapphire Ingot
    • - Cup Wheel for the Sapphire Boule's C reference surface machining
    • - Cup Wheel for Ingot C surface flat screen
    • - Cup Wheel for cylindrical ingot grinder
  • Sapphire Wafer
    • -Back Grinder Wheel for Wafer Thinning Machining

Distinctive Features

  • Quality First product design
  • Improved process productivity and material life time
    • - Optimize process customized to the machine & material

SAPPHIRE METAL GRINDING WHEEL(Non-Dressing type)

  • METAL GRINDING WHEEL

    Tornado Type 250 ~ 380 Ø
    #170 ~ #325 Metal wheel

  • METAL GRINDING WHEEL
  • METAL GRINDING WHEEL

    Ring Type 313 Ø
    #170 ~ #500 Metal wheel

SAPPHIRE VITRI GRINDING WHEEL / Workpiece

  • Sapphire Grinding Wheel / Workpiece

    297Ø #270 Vitrified wheel

  • Sapphire Grinding Wheel / Workpiece

    Ingot grinding wheel

  • Sapphire Grinding Wheel / Workpiece

    Sapphire Ingot and Wafer

Sapphire (LED Material)

What is a Grinder Wheel befitting the LED process?

  • Wheel design for minimizing grinding load
    • - Minimize wafer damage by reducing contacting area between wheel's blades and wafer surface
    • - Optimization of blade’s geometry and arrangement for easy grinding sludge ejection
  • Quality-driven wheel design as well as lifetime
Secure wafer discharge path Improve grinder performance

Processing material (Sapphire)

Processing material (Sapphire)
Mineral Type Hardness (Mohs) Processing margin Remarks
Diamond 10 - Processing tool
SiC 9.7 3% SiC & Sapphire share the very similar hardness with the Diamond tools, which means it rarely leaves processing margin. Therefore, special wheels need to be designed.
Sapphire 9.6 4%
~ ~ ~
Si 6.2 38%
Fe 4.5 55%
Zinc 3.5 65%
Gold 2.5 75%
Lead 1.5 85%
Graphite 1 90%