Home > Semiconductor Tools > LED Tool
Sapphire LED Grinding Wheel
Usage
- Sapphire Ingot
- - Cup Wheel for the Sapphire Boule's C reference surface machining
- - Cup Wheel for Ingot C surface flat screen
- - Cup Wheel for cylindrical ingot grinder
- Sapphire Wafer
- -Back Grinder Wheel for Wafer Thinning Machining
Distinctive Features
- Quality First product design
- Improved process productivity and material life time
- - Optimize process customized to the machine & material
SAPPHIRE METAL GRINDING WHEEL(Non-Dressing type)
SAPPHIRE VITRI GRINDING WHEEL / Workpiece
Sapphire (LED Material)
What is a Grinder Wheel befitting the LED process?
- Wheel design for minimizing grinding load
- - Minimize wafer damage by reducing contacting area between wheel's blades and wafer surface
- - Optimization of blade’s geometry and arrangement for easy grinding sludge ejection
- Quality-driven wheel design as well as lifetime
Processing material (Sapphire)
Processing material (Sapphire)
Mineral Type |
Hardness (Mohs) |
Processing margin |
Remarks |
Diamond |
10 |
- |
Processing tool |
SiC |
9.7 |
3% |
SiC & Sapphire share the very similar hardness with the Diamond tools, which means it rarely leaves processing margin. Therefore, special wheels need to be designed. |
Sapphire |
9.6 |
4% |
~ |
~ |
~ |
Si |
6.2 |
38% |
Fe |
4.5 |
55% |
Zinc |
3.5 |
65% |
Gold |
2.5 |
75% |
Lead |
1.5 |
85% |
Graphite |
1 |
90% |