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Silicon Tool
Usage
- Wafer Back Grinder Wheel that adjusts the thickness of wafer to facilitate chip package for patterned wafer which is pre-fabricated, a pre-process in the semiconductor manufacturing process.
Distinctive Features
- Si Wafer Damage Relief Design
- Design to minimize the damage area. Wheel design considering the surface roughness of wafer
- Gettering effect wheel design
ACCRETECH 12 inch
DISCO 12 inch
OKAMOTO 12 inch
8 inch
Si wafer
What is a Grinder Wheel befitting the semiconductor process?
Wheel design considering roughness
YDI makes wheels that meet the requirements of the process and those that the customers need.
