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Micro Blade
Usage
- Mechanical diamond blade for IC chip cutting used to cut out the wafers to a specified size to make IC Package at the end of the wafer thinning in the semiconductor manufacturing process.
- Produces vitrified diamonds, metals, resins and blades for precise and highly efficient cutting of various materials for semiconductor parts (silicon wafer / sapphire / alumina / LCD (substrate)) and electronic parts.
Distinctive Features
- Si Wafer Damage Relief Design
- Productivity & product life optimization design
Indication
| BOND type | Abrasive grain | Grit size | BOND hardness | Concentration degree | Type | Thickness | Outer diameter |
|---|---|---|---|---|---|---|---|
| Vitrified | SD | 600 | J | 75 | 56D | 0.1T | 40H |
| Resin | SD | 600 | - | 75 | 56D | 0.1T | 40H |
| Metal | SD | 600 | - | 75 | 56D | 0.15T | 40H |
Blade Bond Type
| BOND type | Abrasive grain type | BOND hardness | BOND type | Concentration degree |
|---|---|---|---|---|
| Vitrified | SD CBN |
G~S | - | 20~125 |
| Resin | SD/SDC CBN |
- | BA/BB BQ/BS |
15~125 |
| Metal | SD CBN |
- | MH/MS/M43/M18/MQ | 15~125 |
Standard Grit Size
| Grit size | Density |
|---|---|
| - | #200 |
| - | #230 |
| - | #270 |
| - | #325 |
| 40/60 | #400 |
| 30/40 | #500 |
| 20/30 | #600 |
| 10/20 | #800 |
| 8/16 | #1000 |
| 6/12 | #1200 |
| 5/10 | #1500 |
| 4/8 | #2000 |
| 2/6 | #3000 |
Blade Manufacture Size, Tolerance
| BOND type | Item | Manufacturing range | Tolerance | |
|---|---|---|---|---|
| Vitrified | Outer diameter | φ125mm or less | ±0.02 | |
| Inner diameter | 88.9H, 40H, 25, 4H | H7 | ||
| Thickness | 0.07~0.6mm | ±0.015 | ||
| Resin | Outer diameter | φ125mm or less | ± 0.02 | |
| Inner diameter | 88.9H, 40H, 25, 4H | H7 | ||
| Thickness | 0.05~0.1mm | OD φ50 ~ φ90 | -0.01~-0.015 | |
| 0.11~0.5mm | ±0.01 | |||
| 0.1~0.5mm | OD φ91 ~ φ125 | ±0.015 | ||
| Metal | Outer diameter | φ110mm or less | ±0.02 -0 | |
| Inner diameter | 88.9H, 50H/40H, 25, 4H | H6 | ||
| Thickness | 0.05~0.5mm | ±0.005 | ||
